SMT Assembly Capabilities of Accelerated Assemblies
Over the years, we have improved our SMT assembly services to meet complex client requirements. The following capabilities have contributed to our growth as a leading surface mount assembly services in the US.
pcb product field:
Communication terminal, communication station, electronic communication, computer, home appliance, electrical appliance, SD card, SG card, mobile phone, computer, automobile, finance, aerospace, aviation, medical, military, led, power control power supply, industrial power supply, computer, office Equipment, digital products, computers, LCD, etc .;
fpc product field:
CD-ROM, hard disk, printer, fax machine, scanner, sensor, mobile phone, walkie-talkie antenna card, high-end camera, digital, camera, laser head, CD-ROM, medical, instrumentation, drive, automotive instrumentation, medical instrument, led light, lighting, Copper-based electronics, aviation, aviation, national defense and other high-tech products, more than 70% of the products are exported to the Americas, Europe, Japan, Asia Pacific and other countries and regions.
- Component Packages: Currently, we can assemble the following component packages:
- Ball Grid Array (BGA)
- Ultra-fine Ball Grid Array (uBGA)
- 0201 and larger chip-type components
- Quad Flat Pack No-Lead (QFN)
- Small Outline Integrated Circuit (SOIC)
- Plastic Leaded Chip Carrier (PLCC)
- Quad Flat Package (QFP)
- Package-On-Package (PoP)
- Chip-scale Package (CSP)
- Board Sizes: We can provide the SMT assemblies in the following board sizes:
- 2″x2″ (50.8mm x 50.8mm) min to 20″x18″ (508mm x 457.2mm) max
- Single sided
- Double sided
- Fine Pitch Placement: Our fine pitch placement ability is not limited to these:
- Leaded Minimums : .0065″ (.16mm) width /.010″ (.25mm) pitch
- CSP/BGA Minimums: .010″ (.25mm) diameter / .021″ (.53mm) pitch
- Standards and Compliances: Our surface mount assembly services adhere to the following standards and compliances:
- ISO 9001:2008 certified
- RoHS
- ISO: 13485:2003 certified
- MIL-PRF-55110
- ITAR
- High-speed Automation: We rely on the following state-of-the-art SMT lines for ensuring the fastest production in the industry.
- Stencil Printing Machine
- Flexible Component Placement Systems
- Reflow Ovens
- Rheometer ( for adhesives, solder pastes, and epoxy analysis)
- Wave Soldering Systems
- Acoustics Scanning Microscopes ( for crack and void checking)
- Microscopy X-ray Inspection Machine
- Vitronics Reflow Ovens
- In-line Aqueous Cleaners
- Testing and Inspection: Every PCB manufactured at our facility undergoes rigorous testing and inspection. We assure 100% AOI (Automated Optical Inspection) of Surface Mount Assemblies. We employ the following evaluation process to ensure the highest quality of the PCBs.
- Vibration and Shock Testing
- Scanning Electron Microscopy (SEM)
- Cross-sectioning, Specimen Preparation and Evaluation
- Humidity and Temperature Testing
- Environment Chamber: Humidity and temperature are the two factors that may have a negative impact on the assembly process. Thus, we tightly monitor and control these processes inside our facility to minimize their impact. We also take precautions to protect the sensitive electronic components on the printed circuit board from ESD (Electrostatic Discharge).
For more information about Accelerated Assemblies surface mount assembly services, please contact usat the earliest. Our experts are eager to help you with the right specifications, and value effective surface mount PCB assembly services.
FAQ:
Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
Q: Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production
Q: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?
A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing
Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.
PCB, FPC process production capability
| Technical ltem | MassProduct | Advanced Technology |
| 2016 | 2017 | 2018 |
| Max.Layer Count | 26L | 36L | 80L |
| Through-hole plate | 2～45L | 2～60L | 2～80L |
| Max.PCBSize(in) | 24*52" | 25*62" | 25*78.75" |
| The layer number of FPC | 1～36L | 1～50L | 1～60L |
| Max.PCBSize(in) | 9.8"*196" | 9.8"*196" | 10"*196"Reel to reel |
| Layeredplatelayer | 2～12L | 2～18L | 2～26L |
| Max.PCBSize(in) | 9"*48" | 9"*52" | 9"*62" |
| Combination of hard and soft layers | 3～26L | 3～30L | 3～50L |
| Interconnect HDI | 5+X+5Interconnect HDI | 7+X+7Interconnect HDI | 8+X+8,Interconnect HDI |
| HDI PCB | 4～45L | 4～60L | 4～80L |
| Interconnect HDI | 3+20+3 | 4+X+4Interconnect HDI | 4+X+4,Interconnect HDI |
| Max.PCBSize(in) | 24"*43" | 24"*49" | 25"*52" |
| Material | FR-4 Rogers | FR-4 Rogers | FR-4 Rogers |
| Base material | Halogenfree,LowDK | Halogenfree,LowDK | Halogenfree,LowDK |
| Build-up Material | FR-4 | FR-4 | FR-4 |
| BOard,Thickness(mm) | Min.12L(mm) | 0.43 | 0.42～8.0mm | 0.38～10.0mm |
| Min.16L(mm) | 0.53 | 1.60～8.0mm | 0.45～10.0mm |
| Min.18L(mm) | 0.63 | 2.0～8.0 | 0.51～10.0mm |
| Min.52L(mm) | 0.8 | 2.50～8.0mm | 0.65～10.0mm |
| MAX(mm) | 3.5 | 10.0mm | 10.0mm |
| Min.CoreThickness um(mil) | 254"(10.0) | 254"(10.0) | 0.10～254(10.0mm) |
| Min.Build up Dielectric | 38(1.5) | 32(1.3) | 25(1.0) |
| BaseCopperWeight | Inner Layer | 4/1-8 OZ | 4/1-15 OZ | 4/1-0.30mm |
| Out Layer | 4/1-10 OZ | 4/1-15 OZ | 4/1-30 OZ |
| Gold thick | 1～40u" | 1～60u" | 1～120u" |
| Nithick | 76～127u" | 76～200u" | 1～250u" |
| Min.HOle/Land um(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) |
| Min.Laser via/landum(mil) | 60/170(2.4/6.8) | 50/150(2/6) | 50/150(2/6) |
| Min. IVH,Hole size/landum(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) |
| DieletricThickness | 38(1.5) | 32(1.3) | 32(1.3) |
| 125(5) | 125(5) | 125(5) |
| SKipvia | Yes | Yes | Yes |
| viaoNhie(laserviaon BuriedPTH) | Yes | Yes | Yes |
| Laser Hole Filling | Yes | Yes | Yes |
| Technicalltem | Mass Product | Advanced Technolgy |
| 2017year | 2018year | 2019year |
| Drill hole depth ratio | ThroughHole | 2017year | .40:1 | .40:1 |
| Aspet Ratio | Micro Via | .35:1 | 1.2:1 | 1.2:1 |
| Copper Filling Dimple Size um(Mil) | 10(0.4) | 10(0.4) | 10(0.4) |
| Min.LineWidth＆space | lnner Layer um(mil) | 45/45(1.8/1.8) | 38/38(1.5/1.5) | 38/38(1.5/1.5) |
| Plated Layer um(mil) | 45/45(1.8/1.8) | 38/38(1.5/1.5) | 38/38(1.5/1.5) |
| BGAPitch mm(Mil) | 0.3 | 0.3 | 0.3 |
| Min.PTH Hole ring um(mil) | 75(3mil) | 62.5(2.5mil) | 62.5(2.5mil) |
| Line Width Control | ∠2.5MIL | ±0.50 | ±0.50 | ±0.50 |
| 2.5Mil≤L/W∠4mil | ±0.50 | ±0.50 | ±0.50 |
| ≦3mil | ±0.60 | ±0.60 | ±0.60 |
| Laminated structure | Layer by layer | 3+N+3 | 4+N+4 | 5+N+5 |
| Sequential Build-up | 20L Any Layer | 36L Any Layer | 52L Any Layer |
| Multi-layer overlay | N+N | N+N | N+N |
| N+X+N | N+X+N | N+X+N |
| sequential Lamination | 2+(N+X+N)+2 | 2+(N+X+N)+2 | 2+(N+X+N)+2 |
| Soft and hard bonding | 2+(N+X+N)+2 | 2+(N+X+N)+2 | 2+(N+X+N)+2 |
| PTH filling process | PTH resin plug hole + plating fill
Electroplated hole/copper plug hole | PTH resin plug hole + plating fill
Electroplated hole/copper plug hole | PTH resin plug hole + plating fill
Electroplated hole/copper plug hole |
Titan PCB Lead Time (Days)
| Items | Sample | High Volume |
| Single Sided PCB | 1-3 | 4-7 |
| Double Sided PCB | 2-5 | 7-10 |
| Multi-layer PCB | 7-8 | 10-15 |
| PCB Making & Assembly | 8-15 | 15-20 |
